Heatsink device of video graphics array and chipset

ABSTRACT

Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heatsink device of video graphicsarray (VGA) and chipset, and in particular relates to a heatsink deviceof VGA and chipset to dissipate heat generated from computer, such asVGA and chipset, more effectively.

2. Description of the Related Art

Regarding to heatsink devices of computer elements, the heatsink devicecommonly designs on each computer element, such as central processingunit (CPU), video graphics array (VGA), or chipset. The conventionalheatsink device not only occupies inside space of computer case but alsocannot save cost. In addition, in a single computer element, the heatdissipation area of heatsink device has a limitation, so the heatdissipation on a computer element will also be affected. Relatively,when heat dissipation is not functioning well, the operate effect ofeach computer element is getting decreasing. After a long time use, theelements will have problems of motion harmful and life decreasing.

Above situation will persecute users, therefore; it is necessary toprovide a heatsink structure for dissipating heat generated from VGA andchipset, when VGA and chipset are in action. To be effectively heatdissipating, the important issues need to be solved are increasing heatdissipation area and saving space and cost.

SUMMARY OF THE INVENTION

In view of above prior art questions, the main purpose of this inventionis to provide a heatsink device for dissipating heat generated from VGAand chipset simultaneously in order to solve a drawback of occupying toomany space for traditional heatsink device in a computer element, toovercome the poor heat dissipation problem, and to provide a newheatsink for cost saving.

To fulfill the above-mentioned objects, this invention provides aheatsink device for VGA and chipset. The main characteristic is makingan integrated design for heatsink devices. The new heatsink designrelies on increasing heat dissipation area on a heatsink plate and putthe heatsink plate on VGA and chipset. Also, it integrates other heatgenerated elements stacking below the heatsink plate to dissipate moreheat, so as to increase heat dissipation effect of the heatsink plate.

For better knowledge and understanding of characteristics, purposes andfunctions of the disclosed invention, the detailed descriptions are asfollows:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is the schematic diagram of main elements of present invention;

FIG. 2 is the 3D view of the present invention;

FIG. 3 is the 3D view of diagram showing a heatsink of the presentinvention stocking on a motherboard;

FIG. 4 is the bottom view of the present invention;

FIG. 5 is the top view of the present invention; and

FIG. 6 is another 3D view of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The invention is a heatsink device of video graphics array (VGA) andchipset. The main characteristic is to integrate different heatsinkdevices into a heatsink plate stacked on VGA and chipset. The heatsinkplate has more heat dissipation area than that of the conventionalheatsink, and it also integrates other heat generated elements stackingbelow the heatsink plate to dissipate more heat, so as to increase heatdissipation effect of the heatsink plate and replace the traditionalheatsink devices set up on CPU, VGA, and chipset individually, frompredicaments of occupying many space, poor heat dissipation function,and higher cost.

For better knowledge and understanding of characteristics, purposes, andfunctions of the disclosed invention, the detailed descriptions are asfollows.

As shown in FIG. 1, the present invention provides a heatsink device 1for VGA and chipset, including a heatsink plate 10, a floating leafspring 20, at least two heat dissipation tubes 30, a sliding block 40,and a heat dissipating pad 50.

The heatsink plate 10 has a protruding shape. Its lower surface 11 setup a heatsink pedestal 13 which contacts with VGA and a chipset heatsinkpedestal 14 which contacts with chipset heatsink flat-top. In addition,the floating leaf spring 20 is a floating spring. The upper surface ofthe floating leaf spring 20 including at least two holes 21, at leasttwo fixtures 22, and at least two heat dissipation tubes 30. The slidingblock 40 is an angle rotatable and adjustable sliding block whichcomprises at least two through holes 42. The two through holes 42 areused for accommodating at least two heat dissipation tubes 30. The twoheat dissipation tubes 30 inside contain fiber and heat conductionmedium.

About the forming method of the present heatsink device 1 for VGA andchipset, it takes a one-body forming method for making the heatsinkplate 10 of a heatsink device 1 for VGA and chipset as itscharacteristics.

According to FIG. 1 again, the VGA heatsink pedestal 13 and the chipsetheatsink pedestal 14 on the lower surface 11 of the heatsink plate 10 ofthe present invention are formed by stamping process. Firstly, providinga board, and then stamping the board and making it plastic deformationby using stamping module, it makes the board become a heatsink plate 10.The suitable position of lower surface 11 of the heatsink plate 10 isalso been stamped at the same time to form a flat-top contacting withVGA and a flat-top contacting with chipset. The flat-top contacting withthe VGA is a VGA heatsink pedestal 13 and the flat-top contacting withthe chipset is a chipset heatsink pedestal 14. Via stamping module, theedge of the heatsink plate 10 comprises several edge holes 15 which usefor connecting with motherboard. Further, the VGA heatsink pedestal 13on the upper surface 12 of the heatsink plate 10 sets up at least twoholes 16 which use for connecting with the floating leaf spring 20.

As shown in FIG. 3 is a conventional motherboard 100. The upper surface101 of the motherboard 100 set up a VGA 110 and at least a chipset 120.Furthermore, the upper surface 111 of the VGA 110 has a heatsinkflat-top 112 and the upper surface 121 of chipset 120 has a heatsinkflat-top 122.

For better knowledge and understanding of characteristics of a heatsinkdevice of video graphics array (VGA) and chipset disclosed in thepresent invention have the detailed descriptions with drawings. Firstly,according to FIG. 1, before a heatsink plate 10 is stacked and locked onthe upper surface 101 of a motherboard 100, a heatsink dissipation pad50 is stacked to the lower surface 41 of a sliding block 40 in advance.Then, the sliding block 40 is set up at the lower surface of VGAheatsink pedestal 13 of the heatsink plate 10. In the other words; asshown in FIGS. 2, 3, and 4, FIG. 4 is a bottom view of a heatsink device1 of VGA and chipset of the present invention. A sliding block 40 is setup at between a VGA heatsink pedestal 13 and the heatsink flat-top 112of a VGA 110. Further, the heatsink dissipation pad 50 is set up atbetween the sliding block 40 and the heatsink flat-top 112 of the VGA110. After finished the fabricating motions, one can set up at least twoheat dissipation tubes 30 on through holes 42 of the sliding block 40and then fix the heatsink plate 10 on the motherboard 100 by the way ofedge holes 15 of the heatsink plate 10, so as to finish this fabricatingmotion, and let the connecting tolerance of a heatsink plate 10 and themotherboard 110, or the height different of a heatsink plate 10 and theheatsink flat-top 112 of a VGA 110, decrease to the minimum due to thesliding block 40 can be rotated and adjusted its angle. It means it canlet the sliding block 40 stacks on the heatsink flat-top 112 of VGA 110flatly to increase uniform heat dissipating.

According to FIG. 5, FIG. 5 is the top view of a heatsink device 1 ofVGA and chipset of the present invention. When a heatsink plate 10 isstacked and locked on a motherboard 100 has been finished, a floatingleaf spring 20 is then set up at the upper surface 12 of the heatsinkplate 10. More embodiment is that, by the way of fixing the at least twofixtures 22 of the floating leaf spring 20 on the at least two holes 16of the heatsink plate 10, the floating leaf spring 20 is set up at theupper surface of VGA heatsink pedestal 13 to avoid the heatsink plate 10oppressing in VGA 110 directly and to avoid VGA 110 being warped anddamaged.

While finished above fabricating motions, it means a heatsink device 1of VGA and chipset has set up at a motherboard and finished allfabricating motions. According to FIG. 3 again, the heat, that VGA 110generated when it operates, can be absorbed by the sliding block 40 andpass to the at least two heat dissipation tubes 30. When tubes becamevacuum, one end of the at least two heat dissipation tubes 30 is closedto VGA 110. Heat absorbed by the sliding block 40 will pass to the otherend, because of the at least two heat dissipation tubes 30 insidecontaining fiber and heat conduction medium. The heat conduction mediumis cooling and comeback to original place repeatedly, when heat pass tofar end of the VGA 110. The heat generated by the VGA 110 has been carryout effectively, or the heat absorbed by the at least two heatdissipation tubes 30 can carry to heatsink fan for heat dissipation.Both of above can reach to the purpose of heat dissipation. In addition,as FIGS. 2 and 3 shown, The chipset heatsink pedestal 14 is connectedwith the chipset 120 of the motherboard 100 and adhered on the heatdissipation flat-top 122 of the chipset 120, so the heat of chipset canbe dissipated by the chipset heatsink pedestal 14. Moreover, because thechipset 120 is not the main thermal source, the chipset heatsinkpedestal 14 is enough for the chipset 120 to achieve the purpose of heatdissipation and cooling.

As shown in FIG. 6, the heatsink device of VGA and chipset of thepresent invention. The above embodiment disclosed, using two pieces ofheat dissipation tubes to help the heatsink for heat dissipation, butnot to limit present invention. It can also use at least one piece ofheat dissipation tube to help the heatsink for heat dissipation.Further, at least one piece of heat dissipation tube can collocate onheatsink flat-top of a CPU, to help the CPU for heat dissipation andmake the CPU working more effectively.

During the heatsink devices of VGA and chipset of the present inventionfabricating, when a heatsink pad 50 and a sliding block 40 are going toconnect closely, one can pave a layer of insulator between them toisolate the electric conductivity between the heatsink pad 50 and thesliding block 40.

After the heatsink devices of VGA and chipset of the present inventionhave been fabricated, owing to a heatsink plate set up on a motherboard,the heatsink plate can be the crutch of keyboard in a notebook computer.It means that the keyboard can be set up at the heatsink plate andsupported by the heatsink plate to achieve the goal of saving elementand decreasing cost.

The heatsink plate of present invention is designed for main thermalsource such as VGA and chipset, but it is not used to limit presentinvention. Therefore, the heatsink plate of present invention can havedifferent designs. The heatsink can change its sharp and size and havingdifferent heatsink pedestal designs corresponding to main thermal sourceof computer elements. The present invention can increase effect and savecost comparing to the prior art. To operate present invention can alsosolve the heat problem of thermal source of computer in heatsink device.Besides, it does not occupy more space inside the computer for heatsinkdevice, and it can provide higher function of heat dissipation toconquer the problems of heat dissipation.

The present invention has integrated many years' design experiences todesign a heatsink device for dissipating the heat generated by VGA andchipset. It provides advantages of higher efficiency of heat dissipationand decreased cost and it also can be seen that the present inventionhas more effect increasing than that of past.

Although the invention has been explained in relation to its preferredembodiment, it is not used to limit the invention. It is to beunderstood that many other possible modifications and variations can bemade by those skilled in the art without departing from the spirit andscope of the invention as hereinafter claimed.

1. A heatsink device of video graphics array and chipset, comprising: aheatsink plate, having several edge holes on its edge, said heatsinkplate further comprising: a heatsink pedestal of video graphics array,set up at suitable position of the lower surface of said heatsink plate,and the upper surface of said heatsink pedestal of video graphics arrayhaving at least two holes; and a chipset heatsink pedestal, set up atsuitable position of lower surface of heatsink plate. a sliding block,stocked at the lower surface of said heatsink plate, and including twothrough holes; a heatsink pad, stocked at said sliding block; at least aheat dissipation tube, installed on said through holes of said slidingblock; and an elasticity element, set up at said edge holes of the uppersurface of said heatsink pedestal of video graphics array.
 2. Theheatsink device according to claim 1, wherein said heatsink plate is aheatsink plate.
 3. The heatsink device according to claim 1, wherein aninsulator set on between said sliding block and said heatsink pad. 4.The heatsink device according to claim 1, wherein said heatsink plate isthe crutch of keyboard.
 5. The heatsink device according to claim 1,wherein said heatsink plate is stamped for a one-body forming.
 6. Theheatsink device according to claim 1, wherein said elasticity element isa floating leaf spring.
 7. The heatsink device according to claim 1,wherein said sliding block is a rotatable and adjustable angle slidingblock.
 8. The heatsink device according to claim 5, wherein saidheatsink pedestal of video graphics array of the lower surface of saidheatsink plate is formed by stamping.
 9. The heatsink device accordingto claim 5, wherein said heatsink pedestal of chipset on the lowersurface of said heatsink plate is formed by stamping.